The CD-314Nd/Ti's combination of high power handling, sensitivity, and advanced design technologies enables it to deliver clear and dynamic high-frequency output. The integration of Deplocex technology enhances thermal dissipation, reducing power compression and allowing for consistent performance during extended use. The exclusive titanium dome and surround design, optimized using finite element modeling (F.E.M.), offers a linear and extended frequency response with minimized resonances, resulting in a smooth and natural sound. The inclusion of a copper shorting cap reduces distortion, linearizes inductance, and increases output, further improving sound quality. The proprietary metal alloy phase plug with F.E.M.-optimized geometry enhances performance, while the F.E.M.-optimized high-grade neodymium magnetic circuit improves overall efficiency. The aluminum cover adds structural integrity, ensuring durability in demanding environments. Designed for high-quality sound reinforcement systems, this compression driver delivers exceptional performance for professional audio applications.
In high-performance audio applications, achieving the required magnetic force (Bl) and sound pressure levels (SPL) often involves using single-layer edgewound wire or double-layer round wire coils. However, the double-layer configuration has a drawback: one of the coil layers cannot dissipate heat as effectively as the other. Additionally, flat wire designs typically feature shorter magnetic gaps, which limit power handling and lead to power compression at lower voltages.
Beyma's DEPLOCEX technology addresses these challenges by maximizing the surface area of the coil and magnetic gap, enhancing heat dissipation through radiation while maintaining the same Bl and final SPL. This design improves thermal transmission along the entire coil length in contact with the iron.
As a result, coil temperature is reduced by 30%, minimizing the effects of power compression. This advancement enables high-frequency drivers to achieve over 15% more power.